XINZHIZAO L2023 Intelligent heating table welding platform For IPhone X-16 PRO MAX motherboard CPU IC Camera repair. XZZ L2023 Intelligent Desoldering Station motherboard layered heating platform PCB separation installation tool for iPhone Huawei Samsung Oppo Xiaomi Redmi VIVO OnePlus Nubia IQOO ROG, ect.
XZZ L2023 preheating desoldering station is the upgraded version of the Xinzhizao X360II preheating station.
Option:
1. For iPhone X/11/12/13/14/15/16 Pro Max.
2. For Huawei Mate 40 Pro, 50, 50 Pro/RS, P30 Pro, P50 Pro, Pro Pocket, P60.
3. For Samsung Galaxy S21+, S21 Ultra, S22, S22 Ultra, S23 ultra, S24 Ultra, S23, S23+.
4. For Xiaomi MI 12S, 12S Pro, 12S Ultra, 13 Pro.
5. For Redmi K30 Pro.
6. For Oppo Find N, Find N1 Flip, X5.
7. For VIVO X90 Pro.
8. For IQOO 10 Pro, 11 Pro.
9. For Nubia Z40S Pro.
10. For OnePlus 10 Pro, OnePlus 11.
11. For ROG 6, ROG 7.
XZZ L2023 Desoldering Station manual: https://drive.google.com/file/d/1wn4rIaJVWxOsPPsFy_n4UQ60Ft6ttJhV/view?usp=sharing
XZZ L2023 heating platform 110v heats slowly solution: https://www.youtube.com/shorts/ZSts0I4sAc4
Features:
- XZZ L2023 intelligent desoldering station, no damage to the motherboard, accurate temperature control.
- When the preset temperature is reached, the beeping alarm will be turned on to prevent overheating damage to the motherboard.
- Large operating area, good compatibility, support for larger motherboard desoldering operations, more convenient and fast.
- Clearly display the temperature, up and down temperature control at any time.
- With fast temperature rise, long life, uniform temperature, fast and low thermal complementary growth characteristics.
- Support Android and iPhone X-16 series motherboard lamination separation, screen bracket separation, etc., subsequent continuous updates.
- Extra large heating area, support for Android phones, large operating area, good compatibility.
- support for larger motherboard desoldering operations, more convenient and fast An intelligent desoldering station, with fast heating, long life.
- uniform temperature characteristics, perfect the appearance of the air duct design is more conducive to heat dissipation.
- Innovative design, strong magnetic adsorption, built-in multiple strong magnetic, no snaps, easy to pick up, easy to disassemble,Synthetic stone compression clasp, makes the motherboard fit better.
